# DE-FOA-0003426: RFI Microelectronics Energy Efficiency Scaling for 2 Decades (EES2) R&D Roadmap — Public Feedback

Source: https://welltoldgrants.com/grants/de-foa-0003426-de-foa-0003426-rfi-microelectronics-energy-efficiency/  
Official notice: https://www.grants.gov/search-results-detail/356031

> Golden Field Office offered grants of up to $2 (at least $1) to any type of organization. Applications closed on September 30, 2024.

| Field | Value |
|---|---|
| Opportunity number | DE-FOA-0003426 |
| Agency | Golden Field Office |
| Status | Forecast |
| Deadline | September 30, 2024 |
| Award ceiling | $2 |
| Award floor | $1 |
| Expected awards | not stated |
| Total funding | not stated |
| Cost sharing | not required |
| Assistance Listings | 81.086 |

## Who can apply

- Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled "Additional Information on Eligibility"

## What the grant funds

This is a Request for Information (RFI) issued by the U.S. Department of Energy (DOE) on behalf of the Advanced Materials and Manufacturing Technologies Office (AMMTO). The intent of this RFI is to solicit feedback from affected stakeholders on the EES2 Initiative in general and on the draft Microelectronics Energy Efficiency Scaling for 2 Decades (EES2) Research, Development, and Demonstration (RD&D) Roadmap that accompanies this RFI. The EES2 roadmap focuses on the energy efficiency of computing and the computing stack. Therefore, we have divided our roadmap into eight specialized working groups, each focusing on specific layers of the computing stack or on enabling technologies and approaches. Working group deliberations focused on identifying key emerging, energy-efficient technologies and their challenges and solutions. The EES2 working groups for version 1.0 are: a. Materials and Devices (MnD) b. Circuits and Architectures (CnA) c. Advanced Packaging and Heterogenous Integration (APHI) d. Algorithms and Software (AnS) e. Power and Control Electronics (PaCE) f. Manufacturing Energy Efficiency and Sustainability (MEES) g. Metrology and Benchmarking (MnB) h. Education and Workforce Development (EWD) Responses to this RFI must be submitted electronically to micro.electronics@ee.doe.gov no later than 5:00pm (EDT) on September 30, 2024. Responses must be provided as a Microsoft Word (.docx) attachment to an email. It is recommended that attachments with file sizes exceeding 25MB be compressed (i.e., zipped) to ensure message delivery. This RFI is not accepting applications for financial assistance or financial incentives. EERE may or may not issue a Funding Opportunity Announcement (FOA) based on consideration of the input received from this RFI. Please see the full RFI document for additional information.

## Questions people ask

### Is DE-FOA-0003426 still open?

No. It closed on September 30, 2024.

### Who can apply for DE-FOA-0003426: RFI Microelectronics Energy Efficiency Scaling for 2 Decades (EES2) R&D Roadmap — Public Feedback?

Golden Field Office accepted applications from any type of organization.

### What is the deadline for DE-FOA-0003426: RFI Microelectronics Energy Efficiency Scaling for 2 Decades (EES2) R&D Roadmap — Public Feedback?

Closed September 30, 2024. Applications are no longer accepted; the program's newer notices are on this page when there are any.

### How much funding is available?

Awards of up to $2 each.

### Who has won Conservation Research and Development grants before?

The largest recipients over five fiscal years were Purdue University, General Atomics, North Carolina State University. The program made 710 awards worth $1.7 billion in that time.