# FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates

Source: https://welltoldgrants.com/grants/2024-nist-chips-napmp-01-fy2024-chips-r-d-national-advanced-packaging-manufacturing/  
Official notice: https://www.grants.gov/search-results-detail/352662

> National Institute of Standards and Technology offered grants to the applicants described in the notice. Applications closed on July 3, 2024.

| Field | Value |
|---|---|
| Opportunity number | 2024-NIST-CHIPS-NAPMP-01 |
| Agency | National Institute of Standards and Technology |
| Status | Forecast |
| Deadline | July 3, 2024 |
| Award ceiling | not stated |
| Award floor | not stated |
| Expected awards | not stated |
| Total funding | not stated |
| Cost sharing | not required |
| Assistance Listings | 11.042 |

## Who can apply

- Others (see text field entitled "Additional Information on Eligibility" for clarification)

Eligible applicants include domestic for-profit and non-profit organizations; accredited domestic institutions of higher education including community and technical colleges; and state, local, territorial, and Indian tribal governments. Eligible applicants may only submit one full application under this NOFO. Entities may not be included as subrecipients on more than two applications.

## What the grant funds

The CHIPS Research and Development Program (CHIPS R&D) aims to advance the development of semiconductor technologies and to enhance the competitiveness of the U.S. semiconductor industry. This is the first Notice of Funding Opportunity under this program. It seeks applications for new research and development (R&D) activities to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for producing microelectronics systems.

## Questions people ask

### Is 2024-NIST-CHIPS-NAPMP-01 still open?

No. It closed on July 3, 2024.

### Who can apply for FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates?

National Institute of Standards and Technology accepted applications from the applicants described in the notice. The notice adds further conditions, so read its eligibility section.

### What is the deadline for FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates?

Closed July 3, 2024. Applications are no longer accepted; the program's newer notices are on this page when there are any.

### Who has won CHIPS Research and Development grants before?

The largest recipients over five fiscal years were Activate Global Inc, Octave Photonics LLC, Tiptek, LLC. The program made 18 awards worth $9.8 million in that time.